Base polymers

Nano and Silicone Technology

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Product listing

  • Polymer ST 48

    Polymer ST 48 is especially recommended for the application as sealant for interior or exterior joints, e.g. expansion or connection joints, inte-rior joints for dry walling, joints at staircases.

  • Polymer ST 61

    Polymer ST 61 is a silane-terminated polymer, that is free of plasticizers. Showing both ex-cellent tensile strength and good elongation makes it suitable for demanding wood floor adhesives. With Polymer ST 61 it is possible to formulate either high strength or soft and elastic wood floor adhesives.

  • Polymer ST 77

    Polymer ST 77 is free of phthalates and is highly recommended for demanding applications where a balanced stress-strain behavior is re-quired as in transport and assembly applica-tions. Examples for the use of Polymer ST 77-based formulations are the assembly of superstructural parts, bumpers, etc. Mechanical fastening is often avoided as it could cause damage to the materials used. In addition, it could negatively affect the design.

  • Polymer ST 80

    The specific product design of Polymer ST 80 enables formulators to produce adhesives with high strength combined with an exceptional surface hardness. Therefore, it is possible to address applications that require lower Shore D levels. Today such applications are mostly addressed through 2C-polyurethanes or epoxy putties.

  • Polymer ST 81

    Polymer ST 81 addresses applications where tensile strength of >> 6N/mm² is required. This is especially important in applications that are covered by 1C and 2C-polyurethanes today. Showing an outstanding high tensile strength Polymer ST 81 allows formulators to enter mar-kets such as wood construction, transport and automotive, assembly as well as light-weight construction.

  • TEGOPAC® Bond 150

    TEGOPAC® Bond 150 is recommended for usage as a binder in assembly adhesives and sealant formulations. The combination of outstanding through-cure and excellent elastic recovery properties allows formulations with TEGOPAC® Bond 150 to be used in a number of demanding applications, e.g. in construction of sandwich elements, for flexible bonding in transport applications or for high quality expansion joints.

  • TEGOPAC® Seal 100

    TEGOPAC® Seal 100 is a moisture curing silane-modified polymer recommended for low modulus sealant formulations which are used in construction applications (e.g. for façades, expansion joints, etc. ) or for indoor applications. TEGOPAC® Seal 100 is also recommended for use in sealant and adhesive formulations where vibration and sound dampening is an issue.